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Title:
MULTI-CHIP PRODUCTION WIRING BOARD AND METHOD OF MARKING ON MULTI-CHIP PRODUCTION WIRING BOARD
Document Type and Number:
Japanese Patent JP2009283541
Kind Code:
A
Abstract:

To provide a multi-chip production wiring board for identifying the defectiveness or nondefectiveness of each wiring board area by changing the color of a mark associated with a defective wiring board area, which allows the mark to be reliably recognized by an image recognizing device and the naked eye and suppresses the production of dust (contamination).

The multi-chip production wiring board includes a plurality of wiring board areas WR consisting of defective substrate areas WR and nondefective substrate areas WR, and defective/nondefective identifying marks M associated with the wiring board areas WR, respectively. A defective/nondefective identifying mark M associated with a defective wiring board area WR has the central side that is changed in color by laser emission and the peripheral side whose surface is roughened to an extent that is free from color change by laser emission.


Inventors:
Tokida, Masakuni
Yamazaki, Hiroe
Application Number:
JP2008000131767
Publication Date:
December 03, 2009
Filing Date:
May 20, 2008
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO LTD
International Classes:
H05K1/02; H05K3/00
Attorney, Agent or Firm:
岡本 啓三