Title:
マルチチップ自己調整式冷却ソリューション
Document Type and Number:
Japanese Patent JP6432676
Kind Code:
B2
Abstract:
An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
Inventors:
Smalley, Jeffory, Elle.
Smith, Susan, F.
Plakashi, Mani
Liu, Tao
Bosaku, Henry, Sea.
Coffstad, Harvey, Earl.
Ortiz, Armando, Tee.
Smith, Susan, F.
Plakashi, Mani
Liu, Tao
Bosaku, Henry, Sea.
Coffstad, Harvey, Earl.
Ortiz, Armando, Tee.
Application Number:
JP2017511160A
Publication Date:
December 05, 2018
Filing Date:
September 27, 2014
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L23/40; H05K7/20
Domestic Patent References:
| JP10070383A | ||||
| JP2014138018A | ||||
| JP3139706U | ||||
| JP4263457A |
Foreign References:
| WO2014148026A1 | ||||
| US20140239482 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation