Title:
マルチゲート半導体デバイス
Document Type and Number:
Japanese Patent JP5649687
Kind Code:
B2
Inventors:
高谷信一郎
Application Number:
JP2013097675A
Publication Date:
January 07, 2015
Filing Date:
May 07, 2013
Export Citation:
Assignee:
ウイン セミコンダクターズ コーポレーション
International Classes:
H01L21/337; H01L21/28; H01L21/338; H01L21/822; H01L21/8232; H01L27/04; H01L27/06; H01L27/095; H01L29/417; H01L29/47; H01L29/778; H01L29/808; H01L29/812; H01L29/872
Attorney, Agent or Firm:
功力 Taeko
功力 Eiji
功力 Eiji