To reduce the size and cost and increase the number of metal pins by providing, on one side of a printed circuit board having upper and lower surfaces, two protruding parts formed laterally long along the one side and arranged at prescribed intervals in the thickness direction, and providing one set each of pin blocks on the upper and lower surfaces of the protruding parts.
This multi-inline memory module 301 has protruding parts 331, 332 of laterally long square form, which are formed on one side of a printed circuit board 311 at prescribed intervals in the thickness direction along the one side by use of an insulator. Pin blocks 321-324 having a number of conductive metal pins 341 are formed on the upper surfaces and lower surfaces of the protruding parts 331, 332. A number of semiconductor memory devices mounted on the upper surface and lower surface of the printed circuit board 311 are connected to the corresponding pin blocks 321-324 of the protruding parts 331, 332. According to this, a number of metal pins can be provided without increasing the size of the module 301.
RI SEIJON
KO BOKUBUN
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