To realize a communication IC unit of an antenna mount type.
The multi-layer antenna A is formed by combining a base 11, a 1st coil 21 formed to the base 11, and a 2nd coil 22 laminated on the 1st coil 21 via an insulation film 12. A required high inductance can easily be realized by decreasing the pattern size of the multi-layer antenna A. Integrally joining the multi-layer antenna A with a communication IC module B forms a communication IC unit C.
|JP09006935||RADIO CARD PROCESSOR|
|WO/2008/104567||AN ELECTRONIC PAYMENT, INFORMATION, OR ID CARD WITH A DEFORMATION SENSING MEANS|
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