Title:
多層基板
Document Type and Number:
Japanese Patent JP6447567
Kind Code:
B2
Abstract:
A multilayer substrate includes a stacked body including thermoplastic resin insulating base material layers, a coil, and a first low flow member and a second low flow member including a flowability lower than the flowability of the thermoplastic resin at a temperature during heating and pressurizing. The coil includes linear conductors that are each provided on the insulating base material layers and include a first region surrounded by the linear conductors when viewed in a stacking direction (Z-axis direction) of the insulating base material layers. The first low flow member including a planar or substantially planar shape and the second low flow member including a winding shape, when viewed in the Z-axis direction, are arranged in the first region. The first low flow member, when viewed in the Z-axis direction, at least partially overlaps a second region surrounded by the second low flow member.
Inventors:
Hometown Naoki
Application Number:
JP2016090120A
Publication Date:
January 09, 2019
Filing Date:
April 28, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46; H01F5/00; H01F5/06; H01F17/00
Domestic Patent References:
| JP2005150329A |
Foreign References:
| WO2015129601A1 | ||||
| WO2015129600A1 | ||||
| WO2015005161A1 |
Attorney, Agent or Firm:
Kaede International Patent Office