Title:
多層キャリア箔
Document Type and Number:
Japanese Patent JP6546252
Kind Code:
B2
Abstract:
The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.
Inventors:
Yoyoi
Zheng Katsura
Zhou Ruichang
Zheng Katsura
Zhou Ruichang
Application Number:
JP2017228355A
Publication Date:
July 17, 2019
Filing Date:
November 28, 2017
Export Citation:
Assignee:
Changchun Petroleum Chemical Co., Ltd.
International Classes:
H05K1/09; B32B15/01; B32B15/08; B32B15/098; C25D1/04; C25D1/22; C25D5/12; C25D5/16; C25D5/48; C25D7/06; H05K3/46
Domestic Patent References:
| JP2014193606A | ||||
| JP61034385B1 | ||||
| JP2016026914A | ||||
| JP2013204065A |
Foreign References:
| WO2013161334A1 | ||||
| WO2016093109A1 |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Junzo Koike
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Junzo Koike
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki