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Title:
複層型下敷きテープ
Document Type and Number:
Japanese Patent JP7143987
Kind Code:
B2
Abstract:
To provide an underlay tape in which an amount of an adhesive (glue) transferred from a rear face of a wall paper is less, in which construction can be proper and in which construction failure is hardly generated in an abutment portion, in cutting the overlapped portion of wall papers.SOLUTION: A multi-layer type underlay tape is produced by: sandwiching a net-shaped sheet 4 between an upper layer film 2 and a lower layer film 3; and fixing the upper layer film 2 and the lower layer film 3 by adhesion only at both end portions together with the net-shaped sheet 4. The net-shaped sheet 4 is composed of warp 4B substantially parallel to a longer direction of the multi-layer type underlay tape and weft 4A which is substantially perpendicular to the warp 4B and crosses the multi-layer type underlay tape in a width direction. Material of the lower layer film 3 positioned at a substrate material side in cutting an overlapped portion of wall papers is a low density polyethylene (LDPE) or a high density polyethylene (HDPE).SELECTED DRAWING: Figure 2

Inventors:
Akihiro Nakamura
Masayuki Kurita
Application Number:
JP2018130537A
Publication Date:
September 29, 2022
Filing Date:
July 10, 2018
Export Citation:
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Assignee:
Sansho Tsusho Co., Ltd.
Kurita Tobacco Seedling Production Co., Ltd.
International Classes:
E04F13/07; B32B3/24; B32B5/02; B32B27/32; D06M17/00
Domestic Patent References:
JP2004019411A
JP2008121249A
JP2015036486A
JP2009248250A
JP2004197396A
JP3192127U
JP61068962A
Attorney, Agent or Firm:
Patent Business Corporation Takahashi International Patent Office



 
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