Title:
MULTI-LAYER WIRING BOARD
Document Type and Number:
Japanese Patent JP2003092468
Kind Code:
A
Abstract:
To improve a noise reducing effect with a simple structure in a multi- layer wiring board on which objects to be mounted such as a switch or a connector, etc., are mounted.
The multi-layer wiring board has a multi-layer structure provided with a plurality of wirings including grounding layers 13, 14 and insertion holes 15 to which insulated protrusions 17 provided on an electronic component 11 are inserted. In this board, a conductive material 16 is formed by plating on the inner surface of each hole 15, and the material 16 interconnects the grounding layers 13 and 14.
Inventors:
AOKI SHINJI
Application Number:
JP2001283801A
Publication Date:
March 28, 2003
Filing Date:
September 18, 2001
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K1/02; H05K1/18; H05K3/46; H05K1/11; H05K3/42; (IPC1-7): H05K3/46; H05K1/02; H05K1/11; H05K1/18
Attorney, Agent or Firm:
Tadahiko Ito