Title:
多層配線構造体
Document Type and Number:
Japanese Patent JP6536710
Kind Code:
B2
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Inventors:
Takamasa Takano
Hiroshi Kudo
Hiroshi Kudo
Application Number:
JP2018085442A
Publication Date:
July 03, 2019
Filing Date:
April 26, 2018
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L21/768; H01L23/522; H01L23/532
Domestic Patent References:
| JP2008288234A | ||||
| JP2005175317A | ||||
| JP2008141021A | ||||
| JP2001168126A | ||||
| JP2005317866A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners