Title:
MULTI-LAYERED ELECTRONIC COMPONENT, DETERMINATION METHOD OF MULTI-LAYERED ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF MULTI-LAYERED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2019129183
Kind Code:
A
Abstract:
To provide a multi-layered electronic component, a determination method of the multi-layered electronic component, and a manufacturing method of a multi-layered electronic component, capable of increasing information amount which can be indicated by an identification pattern.SOLUTION: In a multi-layered electronic component 1, a plurality of identification patterns 20 and 21 formed at a different position in a lamination direction is embedded in an inner part of an outer layer part 17. By forming the identification patterns 20 and 21 at the different position in the lamination direction instead of providing only in the same layer, identification information amount which can be reflected in one multi-layered electronic component 1 can be increased.SELECTED DRAWING: Figure 2
Inventors:
SHINDO HIROSHI
GUNJI TOMONORI
NOMURA TOMOYUKI
YOKOMIZO KEIJI
TANAKA HIROBUMI
OGAWA AKIO
CHIKAMATSU TSUTOMU
SAKUSABE HIROTOMO
GUNJI TOMONORI
NOMURA TOMOYUKI
YOKOMIZO KEIJI
TANAKA HIROBUMI
OGAWA AKIO
CHIKAMATSU TSUTOMU
SAKUSABE HIROTOMO
Application Number:
JP2018008179A
Publication Date:
August 01, 2019
Filing Date:
January 22, 2018
Export Citation:
Assignee:
TDK CORP
International Classes:
H01G2/24; H01F27/00; H01G4/30
Domestic Patent References:
| JPH0288201U | 1990-07-12 | |||
| JPH05218600A | 1993-08-27 | |||
| JPH07282184A | 1995-10-27 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami