To provide multi-layered electronic component excellent in connection reliability with other components.

The present multi-layered electronic components 11 comprise a multi-layered section 12, VIA conductors 31, 32 and external terminal electrodes 41, 42. The multi-layered section has a first principal plane 13 and a second principal plane 14. The multi-layered section has a structure in which a plurality of ceramic layer 15 and a plurality of inner electrode layers 21, 22 are laminated alternately. The VIA conductors 31, 32 penetrate a plurality of the ceramic layer 15 and electrically connect a plurality of the inner electrode layers 21, 22. The external terminal electrode 41 of the first principal plane 13 is constructed in a multilevel structure having level difference portions 53. The external terminal electrode 41 is electrically connected to the VIA conductors 31, 32 at a side of the first principal plane 13.