Title:
MULTI-METAL LAYER MEMS STRUCTURE AND PROCESS TO MANUFACTURE IT
Document Type and Number:
Japanese Patent JP2004223708
Kind Code:
A
Abstract:
To provide a structure including a mesh type metal layer flexibly suspended in the air using CMOS process technology and a process to make such structure.
A base sacrifice layer 14, a first metal layer 16, a first sacrifice layer 20, a second metal layer 22, a second sacrifice layer 26 and a third metal layer 28 are sequentially laminated on a silicon substrate 12. A part of each of the second metal layer 20 and the third metal layer 28 respectively forms a micro metal mesh. When each of the sacrifice layers of the micro metal mesh parts is removed by isotropic dry etching, the part of the micro metal mesh is suspended in a state of floating in height to be settled in thickness of the sacrifice layer.
Inventors:
GABRIEL KAIGHAM J
ZHU XU
ZHU XU
Application Number:
JP2004011617A
Publication Date:
August 12, 2004
Filing Date:
January 20, 2004
Export Citation:
Assignee:
AKUSTICA INC
International Classes:
B81C1/00; C23F1/00; H01G4/00; H01G5/00; H01G7/00; H01G9/00; B81B3/00; H01G13/00; H01H59/00; H01L23/48; H01L23/52; H04R19/00; H04R19/02; H04R19/04; H04R31/00; (IPC1-7): B81B3/00; B81C1/00; H04R19/02; H04R19/04; H04R31/00
Domestic Patent References:
| JPH08213803A | 1996-08-20 | |||
| JP2001514434A | 2001-09-11 | |||
| JPH06112509A | 1994-04-22 | |||
| JP2001508940A | 2001-07-03 |
Attorney, Agent or Firm:
Toshiyuki Maruyama
Takao Miyano
Koichi Kitazumi
Toshiya Nagatsuka
Takao Miyano
Koichi Kitazumi
Toshiya Nagatsuka