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Title:
MULTI-PACK THERMOSETTING RESIN COMPOSITION AND PRODUCTION OF CURED RESIN MOLDING
Document Type and Number:
Japanese Patent JP2574089
Kind Code:
B2
Abstract:

PURPOSE: To produce a cured resin molding excellent in heat resistance, mechanical characteristics, machinability, etc., at a high reproducibility from a liq. resin compsn. excellent in storage stability, handleability, and moldability.
CONSTITUTION: The title compsn. comprising specified ants. of component A virtually consisting of a polyisocyanate compd. and component B consisting of (β-methyl)glycidyl (meth)acrylate, a ring-formation catalyst and a free-radical catalyst, and, if necessary, a polyol compd. and/or a polyepoxy compd. in a specified ratio, is reacted in a mold to give a cured resin molding.


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Inventors:
UMETANI HIROYUKI
YAMADA KENKO
Application Number:
JP35555191A
Publication Date:
January 22, 1997
Filing Date:
December 24, 1991
Export Citation:
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Assignee:
TEIJIN LTD
International Classes:
C08F299/06; C08F290/00; C08G18/16; C08G18/67; C08G73/06; C08G73/22; (IPC1-7): C08G18/67; C08G18/16
Domestic Patent References:
JP4120120A
JP5148000A
JP5889611A
Attorney, Agent or Firm:
Maeda Junhiro



 
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