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Patent Searching and Data


Title:
MULTI-POINT GATE DIE DEVICE FOR SANDWICH MOLDING
Document Type and Number:
Japanese Patent JPH07214595
Kind Code:
A
Abstract:

PURPOSE: To provide a multi-point gate die device which enables easy installation of a sandwich molding part and a single material molding part side by side without wasting much of a material.

CONSTITUTION: A multi-point gate die device 1 is equipped with a sandwich molding gate 11. On a third runner 12 connected directly to the sandwich molding gate 11, a first hot runner nozzle 14 which injects a skin material, a skin material reservoir 13 positioned in the downstream side of the first hot runner nozzle 14, and a second hot runner nozzle 15 for core material injection which protrudes to the skin reservoir 13 are provided. A first runner which connects the first hot runner nozzle 14 to a skin material nozzle 21 for an injection device and a second rubber which connects the second hot runner nozzle 15 to a core material nozzle 22 for the injection device are hot runners.


Inventors:
TAKAHASHI KATSUMI
Application Number:
JP3185994A
Publication Date:
August 15, 1995
Filing Date:
February 02, 1994
Export Citation:
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Assignee:
TOYODA GOSEI KK
International Classes:
B29C45/26; (IPC1-7): B29C45/26
Attorney, Agent or Firm:
Yoshiyasu Takahashi