Title:
MULTI SPINDLE BORING DEVICE
Document Type and Number:
Japanese Patent JP2001030022
Kind Code:
A
Abstract:
To bore a reference hole and a product hole in a position relationship of a high precision in any case of a gang die boring method and a grid pattern boring method.
In this multi spindle boring device, which is provided with a moving die 21, which holds plural punches 1 for product hole and reciprocates by driving a strike drive source 10, a fixed die 30 fixedly provided for the reciprocation of the moving die 21 and simultaneously performs many borings to a work W, a reference hole boring part 40, which bores a reference hole by a punch 41a for reference hole independently reciprocating to/from the moving die 21, is integrally provided in the fixed die 30, the position precision of both the punch 1 and the punch 41a hole is secured.
Inventors:
TSUCHIDA TAKASHI
TOYAMA RITSUKO
TOYAMA RITSUKO
Application Number:
JP20501299A
Publication Date:
February 06, 2001
Filing Date:
July 19, 1999
Export Citation:
Assignee:
UHT CORP
International Classes:
B26F1/00; B21D28/24; (IPC1-7): B21D28/24; B26F1/00
Attorney, Agent or Firm:
Masahaya Hayakawa (3 outside)
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