MULTI-STAGE HOT DIPPING DEVICE - Yazaki Corporation

Title:

MULTI-STAGE HOT DIPPING DEVICE

Document Type and Number:

Japanese Patent JP3753359

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a multi-stage hot dipping device which can prevent degradation of wires, suppress degradation of the production efficiency, and easily manufacture a variety of kinds of linear composite materials.
SOLUTION: A multi-stage hot dipping device 1 comprises a plurality of hot dipping devices 2a, 2b and 2c. The respective hot dipping devices 2a, 2b and 2c comprise a pressure vessel 7, a dipping tank 5, an inlet seal part 14, an outlet seal part 15, a throttling part 16, and a wire feeding means 10. The dipping tank 5 is provided within the pressure vessel 7 to store the molten metals 6a, 6b and 6c. The inlet seal part 14 communicates the outside with the inside of the pressure vessel 7. The throttling part 16 is provided between the seal parts 14 and 15 to communicate the inside and the outside of the dipping tank 5 with each other. The wire feeding means 10 feeds wires 4a, 4b and 4c into the dipping tank 5 via the inlet seal part 14. The hot dipping devices 2a, 2b and 2c are disposed in series along the perpendicular direction.

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Inventors:

Takeshi Kamada

Application Number:

JP28814099A

Publication Date:

March 08, 2006

Filing Date:

October 08, 1999

Export Citation:

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