Title:
POLYIMIDE FAMILY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3170174
Kind Code:
B2
Abstract:
PURPOSE: To provide a polyimide family resin composition for an electronic material having high corrosion preventing effect, film remaining preventing effect, and film adhesion effect to copper and a copper alloy without needing surface treatment by plating and an inhibitor.
CONSTITUTION: (B) at least one compound selected from the group comprising 1H-tetrazole, 5,5'-bis-1H-tetrazole, and derivatives of these compounds is included in (A) at least one kind of polyimide family resin selected from the group comprising polyamide acid, solvent soluble polyimide, photosensitive polyamide acid, photosensitive polyamide acid ester, and photosensitive polyimide.
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Inventors:
Akira Tanaka
Satoshi Tasaki
Yasuhiro Yoneda
Takao Yokouchi
Satoshi Tasaki
Yasuhiro Yoneda
Takao Yokouchi
Application Number:
JP11633695A
Publication Date:
May 28, 2001
Filing Date:
April 18, 1995
Export Citation:
Assignee:
日本ゼオン株式会社
富士通株式会社
富士通株式会社
International Classes:
C08G73/10; G03F7/027; C08K5/3472; G03F7/038; G03F7/085; H05K3/28; (IPC1-7): G03F7/085
Domestic Patent References:
| JP6186744A | ||||
| JP2153934A | ||||
| JP770434A | ||||
| JP641305A | ||||
| JP62273260A | ||||
| JP3126708A | ||||
| JP5295274A |
Attorney, Agent or Firm:
Shigeaki Nishikawa
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