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Patent Searching and Data


Title:
MULTILAYER BIMETAL
Document Type and Number:
Japanese Patent JP2002228782
Kind Code:
A
Abstract:

To cope with the diversification of various control uses by accurately realizing a low curve coefficient by a bimetal.

This multiplayer bimetal 1 is provided with a laminated material having a three-layer composition layer of a high thermal expansion member 2, a low thermal expansion member 4 and an intermediate member 3 interposed between the high thermal expansion member 2 and low thermal expansion member 4 and having an intermediate thermal expansion coefficient. In the multiplayer bimetal 1, the plate thickness ratio of the high thermal expansion member 2, intermediate member 3 and low thermal expansion member 4 is set into a range of 20-2.5:60-95:20-2.5, and a curve coefficient of 10×10-6/°C or less is obtained on the basis of such constitution.


Inventors:
Hiroi, Mitsumasa
Application Number:
JP2001000021605
Publication Date:
August 14, 2002
Filing Date:
January 30, 2001
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G01K5/66; C22C38/00; C22C38/08; C22C38/58; G12B1/02; H01H37/52; G01K5/00; C22C38/00; C22C38/08; C22C38/58; G12B1/00; H01H37/00; (IPC1-7): G12B1/02; C22C38/00; C22C38/08; C22C38/58; G01K5/66; H01H37/52