Title:
MULTILAYER BOARD, ELECTRONIC DEVICE USING THE SAME AND METHOD OF MANUFACTURING MULTILAYER BOARD
Document Type and Number:
Japanese Patent JP2014220307
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enhance heat dissipation from an electronic component into a multilayer board.SOLUTION: A multilayer board includes a field via 91 provided directly under a land 61 of a build-up layer 30, and connecting the inner layer wiring 51 and the land 61 thermally and electrically. The field via is shaped so that the width L1 on the electronic component side is narrow, and the width L2 on the core layer side is wide. The heat generated from the electronic component 121 can thereby be diffused when transferring through the field via 91 toward a core layer 20. Consequently, heat transfer through the field via 91 from the electronic component 121 toward the core layer 20 can be promoted, resulting in the enhancement of heat dissipation from the electronic component into the multilayer board.
Inventors:
NAKAMURA TOSHIHIRO
TATSUMI MASAHIDE
YABUTA EIJI
TATSUMI MASAHIDE
YABUTA EIJI
Application Number:
JP2013097229A
Publication Date:
November 20, 2014
Filing Date:
May 06, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2011097054A | 2011-05-12 | |||
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| JP2003338577A | 2003-11-28 | |||
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| JP2007305617A | 2007-11-22 | |||
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Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm