Title:
MULTILAYER CAPACITOR AND MOUNTING BOARD OF THE SAME
Document Type and Number:
Japanese Patent JP2022093275
Kind Code:
A
Abstract:
To provide a multilayer capacitor having improved bending strength and a mounting board of the same.SOLUTION: The present invention provides a multilayer capacitor and a mounting board of the same. The multilayer capacitor includes: a body which includes a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and which further includes an active region where the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively. The upper and lower covers include BT (barium titanate, BaTiO3) and YSZ (Yttria stabilized zirconia).SELECTED DRAWING: Figure 1
Inventors:
SEO YO HAN
KIM MIN HOE
CHO JONG HYUN
SONG MIN SUNG
YUN BYUNG KIL
HWANG JUNG WUN
KIM MIN HOE
CHO JONG HYUN
SONG MIN SUNG
YUN BYUNG KIL
HWANG JUNG WUN
Application Number:
JP2021185647A
Publication Date:
June 23, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30; H01G2/06
Attorney, Agent or Firm:
Longhua International Patent Service Corporation