Title:
MULTILAYER CAPACITOR AND MOUNTING BOARD OF THE SAME
Document Type and Number:
Japanese Patent JP2022099274
Kind Code:
A
Abstract:
To provide a multilayer capacitor and a mounting board of the same, in which properties such as moisture resistance, toughness, and hardness and densification of a cover may be secured at a certain level or more.SOLUTION: The present invention provides a multilayer capacitor and a mounting board of the same. The multilayer capacitor includes; a capacitor body including an active region having dielectric layers and internal electrodes alternately stacked therein, and upper and lower covers disposed on upper and lower surfaces of the active region, respectively; and an external electrode disposed on the outside of the capacitor body. In the upper and lower covers, when a portion between a boundary surface of the active region and a boundary surface of the capacitor body is divided into two regions, a first cover region adjacent to the active region of the two regions includes grains having a core-shell structure doped with Sn. The first cover region includes 20% or more of Sn-doped grains of a core-shell structure relative to the total of grains in the first cover region.SELECTED DRAWING: Figure 1
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Inventors:
SEO CHUN HEE
JEONG JONG SUK
KIM JIN WOO
KIM TAE HYUNG
SEO JEONG WOOK
YOO DONG GEON
YOO JONG HOON
KIM SU BEEN
JEONG JONG SUK
KIM JIN WOO
KIM TAE HYUNG
SEO JEONG WOOK
YOO DONG GEON
YOO JONG HOON
KIM SU BEEN
Application Number:
JP2021200530A
Publication Date:
July 04, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30; H01G2/06
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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