PURPOSE: To prevent a connection failure from occurring between electrodes and between an electrode and an inner conductor pattern in a manufacturing process.

CONSTITUTION: A first process where a green sheet 1 is formed on a film 2 in layer, a second process where a through-hole is bored in the green sheet 1 and the film 2, a third process where a conductive paste 3 is filled into the through-hole for the formation of an electrode 6, a fourth process where the green sheet 1 and the film 2 are pressed to make the filled conductive paste 3 high in filling density, a fifth process where the film 2 is separated off from the green sheet 1, and a sixth process where the green sheets 1 are successively laminated are provided for the formation of a multilayer ceramic board. The conductor paste 3 is made high in density, whereby the shrinkage of an electrode generated at burning is set stable to surely connect the electrodes together or the electrode to an inner conductor pattern.