To prevent the outer surface of a multilater ceramic board from projecting where a conductive paste is placed, when the multilater ceramic board is made by baking a raw laminated body provided with a conductive paste for forming a siring conductive member.
In a raw laminated body 21 to be baked to produce a multilayer ceramic board 22, a ceramic green sheet 23 contains a ceramic material sintered at a low temperature, and a green layer 25 for preventing shrinkage containing a ceramic material for preventing shrinkage, which is not sintered at the sintering temperature of the ceramic material sintered at a low temperature, is formed in relation to a conductive paste body 24. When the raw laminated body 21 having this constitution is baked at a temperature where the ceramic material sintered at a low temperature is sintered, the green layer 25 for preventing shrinkage shrinks the conductive paste 24 substantially only in the direction of thickness, thereby preventing the multilayer ceramic board 21 for being raised.
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