Title:
MULTILAYER CERAMIC BOARD AND METHOD OF PRODUCTION
Document Type and Number:
Japanese Patent JP3646587
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer ceramic board provided, on the opposite major surfaces thereof, with wiring conductors which can be arranged at high density through a shrinkage free process.
SOLUTION: A raw laminate structure 10 comprising a plurality of ceramic green sheets 5 applied with conductive paste 7 for inner wiring conductors 8, 9 is covered, on the opposite major surfaces thereof, with metal foils 11, 12 and a raw composite laminate 13 is fired under that state. In the firing process, shrinkage of the ceramic green sheets 5 is retarded in the direction of major surface by means of the metal foils 11, 12. Following to the firing process, the metal foils 11, 12 are patterned by etching, based on photolithography to form outer conductor films 3, 4.
Inventors:
Norio Sakai
Application Number:
JP30501199A
Publication Date:
May 11, 2005
Filing Date:
October 27, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01B19/00; H01L21/48; H01L23/12; H05K3/46; H05K1/03; (IPC1-7): H05K3/46; H01L23/12
Domestic Patent References:
| JP6314493A | ||||
| JP2001102756A | ||||
| JP786743A |
Attorney, Agent or Firm:
Masaaki Koshiba
Hiroyuki Okamoto
Hiroyuki Okamoto
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