Title:
積層セラミックキャパシタ、その製造方法、積層セラミックキャパシタが内蔵された印刷回路基板及び積層セラミックキャパシタの研磨装置
Document Type and Number:
Japanese Patent JP5718411
Kind Code:
B2
Abstract:
There are provided multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.
Inventors:
Oh Doc Suk
Choi Eun Huk
John Jun Hyun
John Jin Man
Choi Eun Huk
John Jun Hyun
John Jin Man
Application Number:
JP2013132334A
Publication Date:
May 13, 2015
Filing Date:
June 25, 2013
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01G4/12; H01G2/06; H01G4/30; H01G13/00
Domestic Patent References:
| JP2001076964A | ||||
| JP2011151148A | ||||
| JP2012191159A | ||||
| JP2011124529A | ||||
| JP2011014698A |
Attorney, Agent or Firm:
Konobu Kato
Fukukawa Shinya
Fukukawa Shinya