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Title:
MULTILAYER CERAMIC CAPACITOR PACKAGE
Document Type and Number:
Japanese Patent JP2022073573
Kind Code:
A
Abstract:
To provide a multilayer ceramic capacitor package for reducing a surface crack of a multilayer ceramic capacitor during packaging.SOLUTION: A multilayer ceramic capacitor package 100 in which a plurality of multilayer ceramic capacitors 10 are stored, comprises: a long-length-shaped carrier tape 200 provided with a plurality of recessed pockets 210 that are arranged in a longitudinal direction at equal intervals; a long-length-shaped cover tape 300 that is attached to the carrier tape 200 so as to cover openings of the plurality of pockets 210; and the plurality of multilayer ceramic capacitors 10 stored in the plurality of pockets 210, respectively. According to multilayer ceramic capacitors 10 adjacent to each other among the plurality of multilayer ceramic capacitors 10, a density difference between surfaces on opening sides of the pockets 210 is 0% or more and 4% or less.SELECTED DRAWING: Figure 1

Inventors:
WAKASHIMA MASAHIRO
SAITO YUTA
MORI AKITO
Application Number:
JP2020183639A
Publication Date:
May 17, 2022
Filing Date:
November 02, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
B65D85/86; B65D73/02; H01G4/30; H01G13/00
Domestic Patent References:
JP2015147618A2015-08-20
JP2020141091A2020-09-03
JP2005217136A2005-08-11
JP2017028013A2017-02-02
JP2019106528A2019-06-27
JP2016009802A2016-01-18
JP2015222833A2015-12-10
JP2013098528A2013-05-20
Foreign References:
US20160196918A12016-07-07
Other References:
チップ積層セラミックコンデンサ, JPN6023019739, April 2012 (2012-04-01), JP, pages 1 - 29, ISSN: 0005169703
Attorney, Agent or Firm:
Ryuta Kato
Tetsuo Shiba