Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023158299
Kind Code:
A
Abstract:
To provide a multilayer ceramic electronic component with which reliability can be heightened, a circuit board on which the multilayer ceramic electronic component is mounted, and a method for manufacturing the multilayer ceramic electronic component.SOLUTION: The multilayer ceramic electronic component comprises a ceramic element assembly, and first and second external electrodes that face each other in an X-axis direction. The ceramic element assembly has a plurality of internal electrodes, first and second end faces, and four connecting faces that connect between the first and second end faces, and is formed in a rectangular parallelepiped shape. The connecting faces have an uneven region located between the first and second external electrodes. The uneven region is formed along an extension direction that crosses the X axis, and includes a plurality of recesses arrayed along an array direction that is orthogonal to a depth direction and the extension direction, and protrusions disposed between the plurality of recesses. A depth of the recesses in the depth direction is 0.1 μm or more and less than 2.5 μm. An array pitch of the recesses along the array direction is 1 μm or more and 80 μm or less.SELECTED DRAWING: Figure 5
More Like This:
Inventors:
TOMIZAWA SUKEHISA
SUGA YASUTOMO
KATO HARUYA
SUGA YASUTOMO
KATO HARUYA
Application Number:
JP2022068047A
Publication Date:
October 30, 2023
Filing Date:
April 18, 2022
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30; H01G2/06
Attorney, Agent or Firm:
Shuhei Katayama
Previous Patent: Lacrimal duct endoscope and reinforcing member
Next Patent: Self-checkout equipment and self-checkout system
Next Patent: Self-checkout equipment and self-checkout system