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Patent Searching and Data


Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2000357624
Kind Code:
A
Abstract:

To obtain a multiplayer ceramic electronic component with good reliability in which the cracking of sintered ceramic is hardy developed even when subjected to heat shock or stress caused by flexure of a printed circuit board after the component is mounted thereon.

Inner electrodes 3-6 are provided in a sintered ceramic 2 and first and second outer electrodes 7, 8 are formed to cover the first and second end faces 2a, 2b wherein the first and second outer electrodes 7, 8 have electrode covering parts 7a, 8a extending to the upper and lower surfaces 2c, 2d and the opposite side faces of the sintered ceramic. A relation 1.5×Lg≤e≤3.5×Lg is satisfied, where e is the distance between the outermost side end of the outer electrodes 7, 8 and the innermost side end of the electrode covering parts 7a, 8a of the outer electrodes 7, 8, and Lg is the distance between the outermost side end of the outer electrodes 7, 8 and the forward end of the inner electrode connected electrically with the outer electrodes 7, 8 on the opposite side.


Inventors:
HARATANI TATSUO
YONEDA YASUNOBU
TAKAGI GIICHI
Application Number:
JP17005199A
Publication Date:
December 26, 2000
Filing Date:
June 16, 1999
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/232; H01G4/12; H01G4/30; H05K3/34; (IPC1-7): H01G4/12
Attorney, Agent or Firm:
Miyazaki Main Tax