Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023162775
Kind Code:
A
Abstract:
To provide a multilayer ceramic electronic component, a circuit board, and a manufacturing method for the multilayer ceramic electronic component that can achieve high reliability.SOLUTION: A multilayer ceramic electronic component 100 includes an element body 10 including a plurality of dielectric layers 11, and a plurality of internal electrode layers 12 that are laminated with the plurality of dielectric layers 11 interposed therebetween, and are provided so as to face each other and have one ends exposed, and an external electrode 20a and an external electrode 20b that are provided on respective end faces of the element body 10 being the ends in the direction in which the plurality of internal electrode layers 12 extend, are in contact with respective one ends of the plurality of internal electrode layers 12, and include glass 30. The external electrodes 20a and 20b include crystals 40 that contain at least one of the same elements as those contained in the plurality of dielectric layers 11 and are in contact with the element body 10 and the glass 30.SELECTED DRAWING: Figure 6
Inventors:
INOMATA YASUYUKI
SHIMURA TETSUO
MOCHIGI MASAKI
SHIMURA TETSUO
MOCHIGI MASAKI
Application Number:
JP2022073403A
Publication Date:
November 09, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30; H05K3/34
Attorney, Agent or Firm:
Shuhei Katayama