Title:
積層セラミック電子部品及び電子部品実装基板
Document Type and Number:
Japanese Patent JP7353141
Kind Code:
B2
Abstract:
To provide a high-reliability multilayer ceramic electronic component and an electronic component mounting board mounting the same thereon.SOLUTION: A multilayer ceramic electronic component comprises a ceramic element assembly, an external electrode and a metal terminal. The ceramic element assembly includes an internal electrode which is stacked in a first direction, and an end face from which the internal electrode is pulled and which is turned in a second direction orthogonal to the first direction. The external electrode includes a bonding face which is turned in the second direction, and is formed on the end face. The metal terminal includes a bonding part which extends in the first direction and is bonded to the bonding face via a solder. The bonding part includes: an end portion which is separated from the bonding face for a first distance in the second direction; and a bend which is separated from the bonding face for a second distance shorter than the first distance in the second direction and bend in a direction away from the bonding face, and is bonded while being tilted so as to form an angle equal to or greater than 1 degree and equal to or smaller than 15 degrees with respect to the bonding face.SELECTED DRAWING: Figure 5
Inventors:
Yasuyuki Inomata
Masaki Mochiki
Masaki Mochiki
Application Number:
JP2019203389A
Publication Date:
September 29, 2023
Filing Date:
November 08, 2019
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30; H01G2/06; H01G4/228
Domestic Patent References:
| JP2000235931A | ||||
| JP1154623U | ||||
| JP2000182887A | ||||
| JP2018137337A |
Foreign References:
| WO2006022257A1 |
Attorney, Agent or Firm:
Shuhei Katayama