Title:
積層セラミック電子部品及びその製造方法、並びに回路基板
Document Type and Number:
Japanese Patent JP7103835
Kind Code:
B2
Abstract:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first main surface and a second main surface that face in a first direction, internal electrodes laminated in the first direction, and a penetrating hole that has a diameter decreasing from the first main surface toward the second main surface and includes a tapered surface, the internal electrodes being exposed on the tapered surface. The external electrode includes a first conductive layer disposed along the tapered surface, and a second conductive layer disposed along the first main surface and connected to the first conductive layer.
Inventors:
Tomizawa Yuju
Wakae Akaishi
Wakae Akaishi
Application Number:
JP2018082861A
Publication Date:
July 20, 2022
Filing Date:
April 24, 2018
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30; H01F27/29; H01G2/06
Domestic Patent References:
| JP3080514A | ||||
| JP2013042083A | ||||
| JP2006179954A | ||||
| JP2001297944A | ||||
| JP2008078622A |
Foreign References:
| US20180068796 | ||||
| US20130184797 |
Attorney, Agent or Firm:
Patent Business Corporation Minami Aoyama International Patent Office
Junichi Omori
Sekine Masayoshi
Junichi Omori
Sekine Masayoshi
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