Title:
積層セラミック電子部品
Document Type and Number:
Japanese Patent JP7097761
Kind Code:
B2
Abstract:
A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies which each include a multilayer body and first and second outer electrodes provided on both end surfaces of the multilayer body. The multilayer ceramic electronic component also includes a first metal terminal connected to the first outer electrodes and a second metal terminal connected to the second outer electrodes. Each multilayer ceramic electronic component body includes a dimension in a lamination direction that is less than a dimension in a width direction, and is positioned so that one of the first and second side surfaces faces a mounting surface. The first and second metal terminals extend between the first and second outer electrodes of the multilayer ceramic electronic component bodies. The multilayer bodies, first and second outer electrodes, and at least portions of the first and second metal terminals are covered by a cover material.
Inventors:
Retsu Tahara
Tomohiro Kageyama
Tomohiro Kageyama
Application Number:
JP2018122293A
Publication Date:
July 08, 2022
Filing Date:
June 27, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H01G2/06; H01G2/10; H01G4/38
Domestic Patent References:
| JP2004273935A | ||||
| JP627109A | ||||
| JP2018510507A | ||||
| JP245620U | ||||
| JP200624825A | ||||
| JP200225852A | ||||
| JP2016139787A | ||||
| JP9266125A | ||||
| JP2004335877A |
Foreign References:
| CN1707709A | ||||
| WO2017100073A1 |
Attorney, Agent or Firm:
Okada
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