Title:
MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3630372
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which has satisfactory flatness and high dimensional accuracy and has no defects in the vicinities of burned electrodes, and to provide a manufacturing method thereof.
SOLUTION: The ceramic substrate comprises a glass ceramic 6, wiring patterns 2, 4 formed in the glass ceramic 6 and on at least one major surface thereof, and via-conductors 3 for connecting prescribed wiring patterns 2, 4 each other. The via-conductors 3 contain a conductive material whose main component is at least one kind of Ag, Au, Pt and Pd, as well as a 0.05 to 10 pts.wt Mo compound or Mo metal to the 100 pts.wt conductive material in terms of Mo metal.
Inventors:
Ryuichi Saito
Hidenori Katsumura
Hiroshi Kagada
Hidenori Katsumura
Hiroshi Kagada
Application Number:
JP2002306165A
Publication Date:
March 16, 2005
Filing Date:
October 21, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K1/09; H05K1/11; H05K3/46; (IPC1-7): H05K3/46; H05K1/09; H05K1/11
Domestic Patent References:
| JP2001189558A | ||||
| JP2000049431A | ||||
| JP2000165001A | ||||
| JP7086743A | ||||
| JP2000150294A |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners