Title:
MULTILAYER CIRCUIT BOARD, ELECTRONIC MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP3210740
Kind Code:
B2
Abstract:
PURPOSE: To obtain a next generation multilayer circuit board, and a module and electronic device employing the multilayer circuit board, for forming a multilayer thin film circuit having high density wiring while suppressing warp of board and enhancing reliability in connection.
CONSTITUTION: In a multilayer circuit board comprising a board 1 and a multilayer thin film circuit 4 formed of a heat resistant dielectric film 5 and a wiring on the board 1, the heat resistant dielectric film 5 is composed of an organic heat resistant material and an inorganic powder material where the coefficient of linear expansion of the organic heat resistant material is set substantially equal to that of the wiring 6 and the coefficient of linear expansion of the heat resistant dielectric film 5, formed by admixing inorganic powder to the organic heat resistant material, is set substantially equal to that of the board 1. The multilayer circuit board is employed in an electronic module and an electronic device.
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Inventors:
Hideo Arima
Kenji Takeda
Kenji Takeda
Application Number:
JP22953392A
Publication Date:
September 17, 2001
Filing Date:
August 28, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G06F1/18; G06J1/00; H01L23/14; H01L27/01; H05K3/46; (IPC1-7): H05K3/46; G06F1/18; G06J1/00; H01L23/14; H01L27/01
Domestic Patent References:
| JP61176196A | ||||
| JP283963A |
Attorney, Agent or Firm:
Katsuo Ogawa (2 outside)
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