PURPOSE: To enable to change even a resistor and a dielectric into multilayer form, to shape even minute conductor wiring for using a green sheet and to form the circuit substrate having the high degree of integration by employing an insulating material sintered through the heat treatment of 1,000°C or higher as a circuit substrate material and a layer insulating material.
CONSTITUTION: The green sheet made of glass manufactured is used as a printing base body 1, conductive paste adjusted is printed and the first layer wiring 2, electrodes 3 for the resistor and an electrode 4 for a capacitor are shaped, the base body is dried, and resistance paste is printed and the first layer resistor 5 is molded. Electrodes 3' for the resistor, an electrode 4' for the capacitor, an opposite electrode 7' for the capacitor and a terminal 11 for external connection and terminals 12 for loading parts are formed besides the second layer wiring 10 in the same manner as the first layer, the resistance paste and dielectric paste are printed, the conductive paste is further printed onto a dielectric layer, and the second layer resistor 13 and the second layer dielectric 14 are shaped.
SUGISHITA NOBUYUKI
IKEGAMI AKIRA
| JPS55128899A | 1980-10-06 | |||
| JPS50119815A | 1975-09-19 |