To enhance the miniaturization of a case for electronic equipment and the degree of freedom of design while ensuring high mounting density with respect to those which are incorporated into the case.

A multilayer circuit board 1 is arranged such that a number of insulating layers consisting of thermoplastic resin material are stacked, conductor patterns are formed between the insulating layers with the formation of interlayer connectors, and a plurality of electronic parts 3 such as IC chips, are embedded in the insulating layers. The multilayer circuit board 1 should have a shape corresponding to an inner shape of the case 2 into which it is incorporated. In manufacturing the multilayer circuit board 1, the conductor patterns are formed in films each serving as the insulating layers and consisting of the thermoplastic resin of crystal transition. At the same time, base members 12 are formed by filling conductive paste in via holes constituting the interlayer connectors. The base members 12, after being subjected to pre-forming, are stacked while disposing therein the electronic parts 3. Then, hot pressing is performed by using a mold 4 having a shape corresponding to the inner shape of the case 2.