To provide a method of processing a blind hole in a multilayer circuit board which allows easy confirmation of the location of an inner layer and can increase the processing accuracy, and also to provide the multilayer circuit board and a probe for inspection.

Conductor layers 31 of the multilayer circuit board 30 are insulated from each other with insulation layers 32. To each conductor section for a circuit which is to be used as a circuit when the multilayer circuit board 30 becomes a product, a measurement region 31b which is only used for processing is connected. The measurement regions 31b of various layers are aligned horizontally and are so located as to overlap each other in the up and down direction. Prior to processing holes, a V-shaped hole 70 is processed in a place where the measurement regions 31b are located, and the probes 50 for measurement are located in the measurement regions 31b exposed on an inner surface of the hole 70. By measuring the voltages between the probe needles 51 and a rotor shaft, the position of a drill end is controlled.