To provide a thin multilayer combination paper sheet having thickness of ≤150 μm, including IC chips therein and thereby having a large amount of concealed information and excellent in anti-counterfeit effect, where the IC chips are accurately arranged at predetermined fixed positions of the paper sheet.

The multilayer combination paper sheet has the following structure: a nonwoven fabric 2 is combined between a lower paper layer 3 and an upper paper layer 4; a watermark 6 is provided at the paper; IC chips 5 included in the nonwoven fabric 2 are inserted into positions q apart from a positions p of the watermark 6 in a papermaking direction at predetermined intervals s; the lower paper layer 3, the nonwoven fabric 2 and the upper paper layer 4 are combined to each other while fibers are entangled with one another.