To provide dustless paper used as interleaf paper, causing no dust-raising trouble in the process of manufacturing lead frames for electronic circuits mounted with semiconductor elements such as LSIs or liquid crystal panels, excellent in cushionability, and capable of minimizing damage of electronic circuits or liquid crystal panels even if being contaminated with foreign matters such as dust and paper dust.
The multilayer dustless paper having at least a front layer, a back layer, and an intermediate layer composed of one or more layers put in between the front and back layers, wherein at least one layer of the intermediate layer is a cushioning layer containing at least thermally expandable particles and hot-melt fibers. The density of the multilayer dustless paper is 0.55-0.80 g/cm3.
Sadayoshi Igarashi
Susumu Kitano