Title:
MULTILAYER ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2018207090
Kind Code:
A
Abstract:
To provide a multilayer electronic component capable of reducing acoustic noise in an audio frequency region of 20 kHz or less, and high frequency vibration of 20 kHz or more, and to provide a mounting board thereof.SOLUTION: A multilayer electronic component includes a capacitor body, first and second external electrodes placed on the mounting surface of the capacitor body so as to be spaced apart from each other, and first and second connection terminals consisting of insulators, and being connected with the first and second external electrodes. The first connection terminal includes first through third conductive patterns and a first breaking part, and the second connection terminal includes fourth through sixth conductive patterns and a second breaking part. A mounting board thereof is also provided.SELECTED DRAWING: Figure 1
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Inventors:
PARK HEUNG KIL
PARK SE HUN
JI GU WON
PARK SE HUN
JI GU WON
Application Number:
JP2017223914A
Publication Date:
December 27, 2018
Filing Date:
November 21, 2017
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/228; H01G2/06; H01G4/232; H01G4/30
Domestic Patent References:
| JP2017028228A | 2017-02-02 | |||
| JP2013038291A | 2013-02-21 | |||
| JP2000100652A | 2000-04-07 | |||
| JP2016072603A | 2016-05-09 | |||
| JP2014179512A | 2014-09-25 | |||
| JP2016143882A | 2016-08-08 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation