Title:
MULTILAYER FILM, ADHESIVE FILM, AND ADHESIVE FILM FOR SEMICONDUCTOR MANUFACTURING PROCESS
Document Type and Number:
Japanese Patent JP2022093019
Kind Code:
A
Abstract:
To provide a film which is excellent in film formability when a resin is molded into a film shape and which is also excellent in expandability of an obtained film.SOLUTION: A multilayer film includes at least one or more elastomer layers containing a polyolefin resin and a styrenic elastomer having a styrene component content within the range of 20 mass% or more and 60 mass% or less, the content of the styrenic elastomer being 60 mass% or more based on 100 mass% of the total amount of resins constituting the elastomer layers. The ratio of the thickness of the elastomer layers to the total thickness of the film is 70% or more.
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Inventors:
KAWAGUCHI YUJI
Application Number:
JP2020206075A
Publication Date:
June 23, 2022
Filing Date:
December 11, 2020
Export Citation:
Assignee:
DIAPLUS FILM INC
International Classes:
H01L21/301; B32B27/30; B32B27/32; C09J7/38
Attorney, Agent or Firm:
Makoto Ono
Kanayama Sage
Yoshiyuki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Takashi Kono
Yoshikazu Iwase
Yasufumi Shiroyama
Kanayama Sage
Yoshiyuki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Takashi Kono
Yoshikazu Iwase
Yasufumi Shiroyama