Title:
MULTILAYER FLEXIBLE WIRING BOARD, ITS MANUFACTURING METHOD, AND CONNECTION METHOD OF MULTILAYER FLEXIBLE WIRING WITH CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2006179589
Kind Code:
A
Abstract:
To prevent problems such as peeling of an interlayer adhesive layer when connecting a multilayer flexible wiring board having a structure where a plurality of circuit boards are stuck with an interlayer adhesive to another circuit board via an anisotropic conductive film.
A multilayer flexible wiring board is made ino a structure not providing the interlayer adhesive layer 30 (i.e., a structure providing a portion 29 where the interlayer adhesive layer is not provided) on a connection part (connection area with another circuit board 50) 40 of the multilayer flexible wiring board. There is hereby eliminated the possibility that the interlayer adhesive layer 30 is peeled owing to heat upon bonding to realize highly reliable connection.
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Inventors:
SAITO TORU
KAWABATA MICHIHITO
SUZUKI HIROYUKI
KAWABATA MICHIHITO
SUZUKI HIROYUKI
Application Number:
JP2004369577A
Publication Date:
July 06, 2006
Filing Date:
December 21, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/46; H05K3/36
Attorney, Agent or Firm:
Takeshi Takamatsu
Toshimitsu Ichikawa
Kimihide Hashimoto
Toshimitsu Ichikawa
Kimihide Hashimoto
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