Title:
MULTILAYER INJECTION MOLDING
Document Type and Number:
Japanese Patent JP2020037192
Kind Code:
A
Abstract:
To provide a multilayer injection molding showing excellent interlayer adhesion and gas barrier properties.SOLUTION: A multilayer injection molding is composed of a resin composition for injection molding that contains at least (A) layer/(B) layer, the (A) layer containing an adhesive (a) satisfying at least (i)-(iii) of 5 pts.wt. or more and 70 pts.wt. or less, and containing a vinyl alcoholic resin (b) satisfying (iv)-(v) of 30 pts.wt. or more and 95 pts.wt. or less ((a) and (b) totaling 100 pts.wt), the (B) layer being composed of a thermoplastic resin (f). (i) The adhesive has a hydrolysate of a molten mixture containing (c) a thermoplastic resin, (d) a copolymer of ethylene and vinyl ester and/or acrylate, with a vinyl ester and/or acrylate content higher than that of (c) the thermoplastic resin by 5 mol% or more, and (e) a modified body grafted with (c) and (d). (ii) The vinyl alcohol content is 0.5 mol% or more and 40 mol% or less. (iii) The vinyl ester and/or acrylate content is 30 mol% or less. (iv) The ethylene content is 55 mol% or less. (v) The saponification degree is 70 wt.% or more.SELECTED DRAWING: None
Inventors:
MASUDA ATSUSHI
KAWATO DAISUKE
OTAKE MASATO
KODA SHINGO
KAWATO DAISUKE
OTAKE MASATO
KODA SHINGO
Application Number:
JP2018164041A
Publication Date:
March 12, 2020
Filing Date:
August 31, 2018
Export Citation:
Assignee:
TOSOH CORP
International Classes:
B29C45/16; B32B27/30
Domestic Patent References:
| JP2001146116A | 2001-05-29 | |||
| JP2017210608A | 2017-11-30 | |||
| JPS63296911A | 1988-12-05 | |||
| JPS56103234A | 1981-08-18 | |||
| JPH0586146A | 1993-04-06 |