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Title:
MULTILAYER INSULATING PIPE CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2009197834
Kind Code:
A
Abstract:

To provide a multilayer insulating pipe connection structure for connecting the end of a conductor layer of a multilayer insulating pipe and a metal joint body while completely insulating therebetween.

The connection structure includes the metal joint body 2, the multilayer insulating pipe 1 having the conductor layer 1b inside to be suitable for the outer periphery side of the joint body 2, an electric insulating ring 4 mounted between the joint body 2 and the end face of the multilayer insulating pipe 1, and a metal sleeve 3 for fastening the mutilayer insulating pipe 1 at its outside to fix the multilayer insulating pipe 1 to the joint body 2. The electric insulating ring 4 is sectionally recess-shaped to cover the whole end face of the conductor layer 1b of the multilayer insulating pipe 1.


Inventors:
FUJITA SHOGO
HAMANOUE MAKOTO
Application Number:
JP2008037623A
Publication Date:
September 03, 2009
Filing Date:
February 19, 2008
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F16L25/02; F16L11/127; F16L33/20
Domestic Patent References:
JPS3818750Y1
JPH01139193U1989-09-22
JP2002206679A2002-07-26
JPH06286083A1994-10-11
JPS3818750Y1
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka