Title:
MULTILAYER INTERCONNECTION BOARD FOR WAFER COLLECTIVE CONDUCT BOARD, CONNECTOR CONNECTING TO IT, CONNECTION STRUCTURE FOR THEM, AND INSPECTING DEVICE
Document Type and Number:
Japanese Patent JP3898363
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a connection structure, etc., for quickly connecting a connector with ease and without misalignment to the outer peripheral pad of a multilayer interconnection board of a wafer collective contact board.
SOLUTION: In a multilayer interconnection board 10 constituting a part of a wafer collective contact board, an outer peripheral pad 51 formed in the peripheral region of the board is made into a block for standardization, while a guide part (guide hole 53) for guiding and alignment when a connector is connected to the block outer peripheral pad 51, is provided adjacent to it. A connector 60 comprises a clip structure, provided with an engagement part (guide pin 16) to be engaged with or inserted in a guide part 53 and a spring 62. When the multilayer interconnection board 10 is connected to the connector 60, the guide part 53 and the engagement part 16 are engaged together for connection.
Inventors:
Osamu Sugihara
Application Number:
JP35539098A
Publication Date:
March 28, 2007
Filing Date:
November 29, 1998
Export Citation:
Assignee:
HOYA CORPORATION
International Classes:
H01L21/66; (IPC1-7): H01L21/66
Domestic Patent References:
| JP2000028640A | ||||
| JP8005666A | ||||
| JP63107136A | ||||
| JP7297243A |
Attorney, Agent or Firm:
Yasuo Fujimura
Previous Patent: GAME SYSTEM, GAME MACHINE AND INFORMATION STORAGE MEDIUM
Next Patent: CEREAL FLOUR COMPOSITION
Next Patent: CEREAL FLOUR COMPOSITION