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Patent Searching and Data


Title:
MULTILAYER INTERCONNECTION BOARD
Document Type and Number:
Japanese Patent JPH03155193
Kind Code:
A
Abstract:

PURPOSE: To improve a drill straight-drive property and a boiling heat resistance by forming an inner-layer material and an outer-layer material including a specific nonwoven fabric in one piece through a resin layer including a specific nonwoven cloth.

CONSTITUTION: An external-layer material is provided and formed in one piece on the upper surface and/or lower surface of a required number of inner-layer materials including a glass nonwoven fabric through a resin layer including the glass nonwoven fabric. The inner-layer material consists of an electrical circuit which is formed on a single-surface or a double-surface metal-clad laminated plate consisting of a resin such as a phenol resin, a cresol resin, an epoxy resin, and a fluoric resin, an inorganic fiber such as glass and asbestos, an organic synthetic fiber such as polyester, a natural fiber such as cotton, and paper base. But, the glass nonwoven fabric always needs to be used for the base. It is desirable to add a filling agent such as alumina, silica, talc, synthetic resin chip, pulp, and cotton powder to a resin which is dipped into the resin. A single-side metal foil clad laminated plate which is obtained by dipping resin into a base including at least one glass nonwoven fabric is used as the outer-layer material. Individuals such as copper and aluminum or their alloy are used as a metal foil.


Inventors:
HOSOKI NOBUHITO
KOJIMA SHIGEAKI
Application Number:
JP29540989A
Publication Date:
July 03, 1991
Filing Date:
November 14, 1989
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; H05K1/03; H05K3/46; (IPC1-7): B32B15/08; H05K1/03; H05K3/46
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)