PURPOSE: To make it possible to form circuits of a high density and high reliability by forming the circuit of the outermost layer by a plating method in a multilayer interconnection circuit board in which circuits of two or more layers are formed on one surface of the base material.
CONSTITUTION: After lower circuits 2 are formed on the surface of a base material 1 by a plating method, circuit connecting sections 4 are formed on the lower circuits 2 and an insulating material layer 5 is formed so as to cover the lower circuits 2 and the circuit connecting sections 4. Then, after removing the surface layer of the insulating material layer 5 to expose the circuit connecting sections 4, upper circuits 3 are formed on the surface of the insulating material layer 5 by plating. The circuits 3 are formed by plating copper or the like, and it is preferred to employ a semi-additive method. Thus, in forming the upper circuits 3, the formation of the circuits 3 can be performed on the surface of the insulating material layer 5 which has become a planar surface. For this, micro patterns can be formed easily and very precisely.
TAKAHASHI NOBUYUKI
SUZUKI TOSHIYUKI
MATSUSHITA ELECTRIC WORKS LTD
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