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Title:
MULTILAYER-PLATED ALUMINUM OR ALUMINUM ALLOY FOIL
Document Type and Number:
Japanese Patent JP2013007092
Kind Code:
A
Abstract:

To obtain a low-cost, lightweight metal foil that is used as an electromagnetic wave shielding material, a conductive material or a heat conductive material for a radiating substrate, a current collector of an electrode for a secondary battery, an electrode material or an electrical connection material for a printed wiring board, etc., has a high conductivity and a high thermal conductivity and can be mounted and connected by soldering.

The multilayer-plated metal foil comprises an aluminum foil or an aluminum alloy foil of which at least one surface comprises a zinc-immersion plating layer, a nickel-electroplating layer and a tin-electroplating layer that are formed in this order, wherein the zinc-immersion plating layer contains at least one element chosen from Fe, Co, Ni and Cu. The other surface is not subjected to nickel- and tin-electroplating but is roughened by zinc-immersion plating and, if required, is subjected to pickling after the zinc-immersion plating.


Inventors:
Takami, Masato
Morioka, Nobuaki
Application Number:
JP2011000139998
Publication Date:
January 10, 2013
Filing Date:
June 24, 2011
Export Citation:
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Assignee:
FUKUDA METAL FOIL & POWDER CO LTD
International Classes:
C23C28/02; C23C18/31; C25D5/12; C25D5/30; C25D5/44; H05K9/00
Domestic Patent References:
JPH05117790A1993-05-14
JPS6248089A1987-03-02
JPS6248089A1987-03-02
JP2006342369A2006-12-21
JP2009127101A2009-06-11
JP2002059700A2002-02-26
JPH05117790A1993-05-14