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Patent Searching and Data


Title:
MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2007165483
Kind Code:
A
Abstract:

To provide a multilayer printed circuit board which effectively prevents the potential fluctuation of a power terminal of a semiconductor device, i.e., a noise from flowing out to a base power wiring.

The multilayer printed circuit board includes a first power via 8 which is connected to a power terminal 21 of a semiconductor integrated circuit 5 on a first surface layer 12, and penetrates the first surface layer 12 and a second surface layer 13; a ground via which is connected to a ground conductive layer 7, penetrates the ground conductive layer 7 and the second surface layer 13, and is connected to the first power via 8 via a bypass capacitor 3 on the second surface layer 13; a first clearance hole 17 formed on a power conductor layer; and a second clearance hole 22 formed on the ground conductive layer 7. The first clearance hole 17 is formed to be larger than the second clearance hole 22.


Inventors:
AISAKA TORU
Application Number:
JP2005358161A
Publication Date:
June 28, 2007
Filing Date:
December 12, 2005
Export Citation:
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Assignee:
CANON KK
International Classes:
H05K3/46
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura